• Size of Max. Printed Circuit Board: 610mm(L) x 560mm (W) x 4.0mm (T)
  • Size of Min. Printed Circuit Board: 50mm(L) x 50mm (W) x 0.4mm (T)
  • Size of Min. Part: 01005 (0402:0.4mm x 0.2mm), mass production is available.
  • Pitch of Min. IC: 0.4mm
  • Pitch of BGA ball: 0.35mm (Min.), 3.0mm (Max.)
  • Diameter of BGA ball: 0.20mm (Min.), 1.0mm (Max.)
  • Min. Space between two parts: 0.2mm
  • We have started the lead-free manufacturing processes since year 2002.
  • The High-speed glue dispenser is able to accommodate with double-side operating.
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